20khz Ultrasonic Solder Pots for Copper Sheet Tinning high-powered ultrasonic tank

Ultrasonic Soldering Machine ( Dip Soldering Type ) offers highly solid and reliable soldering joints without flux.

The Solbraze Ultrasonic Soldering System makes possible the dip tinning of a wide range of both metallic and non-metallic materials without the use of any flux.

The Ultrasonic Solder Pot is a self contained soldering systems. The high-powered ultrasonic tank provides rapid removal of surface oxides located on the immersed component. Intense cavitation implosions etch through surface oxides exposing a layer of clean base material. The soldering alloy rapidly wets the clean surface providing a uniform bond with superior performance.

Fluxless Soldering of Wire Using Ultrasonic Energy
We have mastered the technique for Fluxless Soldering of Stranded or Braided Wire. Our typical Ultrasonic Soldering Pot has the ultrasonic energy source originating from the bottom of the molten solder. Our Wire Tinning System has the ultrasonic energy source located on the sidewalls of the Soldering Chamber, thus delivering more ultrasonic energy to the location requiring the ultrasonic energy. This new technique allows us to solder components that just could not be soldered before.

Benefits provided by Ultrasonic Soldering Include:

1. The ultrasonic energy micro-etches the substrate providing more tooth and increased bond strength.
2. Micro-etching action is accomplished in several seconds.
3. The soldering alloy's relative viscosity is reduced when acoustically activated.
4. The soldering alloy rapidly wets the clean surface providing a uniform bond with superior performance.
5. The ultrasonic energy draws the solder into the pores of the immersed item.
6. Uniform wetting without the use of a soldering flux. Postsoldering cleaning eliminated.

Ultrasonic Soldering maximizes the effectveness of many joint designs. Sometimes flux is necessary due to the base materials chosen. Ultrasonic Soldering allows for a reduction in the chemical strength of the required flux while improving overall performance.

Features:

• Wide range of melt temperatures available.
• Wide range of soldering alloys available.
• Open top operation.
• Consistent and uniform results.

Parameter:

Characteristics

• Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.

• No need for flux

• Reliable bonding/sealing

• Best used in difficult, small-surface places with limited access

Application coating on:

• Aluminum components

• Ferrite components

• Glass components

• Silicon wafers

• Ceramic components

• Semiconductor chips

• Metals etc.

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